At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.
Our team is looking for a solution engineer for 3DIC (multi chiplet), advance package and board design & analysis. You will be working with top tier customer who pushes the design boundaries to address their needs / problem.
You will also engage closely with R&D to develop / test new technologies around chiplet & package design
Experience :
Experience working with PCIE, Ethernet or similar interface IP. *Experience leading and conducting customer board and package design reviews Experience with resolving signal integrity issues and channel design optimizations for packages and boards.
Experience in power analysis for board / package, AC impedance analysis, printed circuit board power distribution design, and decoupling capacitor optimizations, PDN routing inductance optimization.
Experience using lab equipment (power supply, signal generator, oscilloscope, prober station, TDR, VNA)
Review board / package layouts and simulate for crosstalk concerns, knowledge of transmission line theory, EM theory and terminations.
Hands-on experience in circuit simulation tools : Cadence Spectre, Cadence / Sigrity, scripting languages (Python, Perl, Tcl)
Experience in understanding and simulating ibis AMI models M.S. Electrical / Computer Engineering (or similar degree)
We’re doing work that matters. Help us solve what others can’t.
