3DIC Solutions Architect
Cadence Design Systems, Inc.
hace 5 días

At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.

  • Extensive experiences at physical simulation of thermal, electrical, and stress analyses for the 3D silicon stacking and advanced packaging technologies
  • Solid expertise in 3D-IC thermal solutions including thermal-driven floorplaning and implementation as well as sign-off flows
  • Strong product and program management skills engaging with customer including product / solution spec’ing, evaluation, and adoption
  • Detailed understanding of 3D-IC power analysis and physical sign-off flows
  • We’re doing work that matters. Help us solve what others can’t.

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