At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.
Cadence's CPG Product Management team is hiring for a Product Marketing Manager focused on product / strategy definition and execution for Electronic Design Automation (EDA) software.
The position will have responsibility of directly driving the success of the Allegro-based IC packaging technologies.
Key responsibilities in this position are :
Specializing in fan-out wafer-level packaging technologies, you will establish your technical credibility to become the go-to person for the Cadence advanced IC packaging tools and flows.
Based on customer needs, provide in-depth technical assistance in collaboration with R&D to help support advanced design flows for advanced IC packaging
Champion the customer needs and work with R&D and WFO to develop competitive and creative technical solutions.
Using your hand-on knowledge of the tools and technologies, develop rapid adoption kits for FOWLP packaging technologies.
Understand the competitive landscape and continuously work on differentiating Cadence’s solutions.
Assist WFO in managing strategic customer evaluations / benchmarks on Cadence's IC packaging solutions to establish technology differentiation and assert Cadence competitive advantages.
Contribute to the creation of technical product literature such as application notes and technical articles.
Develop and deliver product demonstrations.
Participate in the creation of new products from pricing through release.
Leverage and build your technical expertise in one or more of the following areas :
Multi-chip(let) packaging architectures
Full-flow, from planning to tape-out for advanced packaging
Physical verification tools for package-level sign-off
Deep technical understanding of modern IC packaging technologies
Bachelor's degree in Electrical or Computer Engineering or Computer Science or equivalent
5+ years of experience in advanced multi-chip(let) package design and analysis
Deep knowledge of Cadence Allegro-based IC packaging solutions
Strong verbal and written communication skills in English
Up to 30% travel
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