NXP Semiconductors N.V. (NASDAQ : NXPI) enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better, and safer.
As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the automotive, industrial & IoT, mobile, and communication infrastructure markets.
Built on more than 60 years of combined experience and expertise, the company has over 29,000 employees in more than 30 countries and posted revenue of $8.88 billion in 2019.
System Architect Wired Connectivity
Candidate Responsibilities :
Architecture, Product definition & Specification of High Speed Interface products like redrivers, retimers,
SerDes products, etc.
End to end System modeling, simulation of signal delivery and performance analysis including losses, crosstalk,
jitter, mode conversion, etc.
Close Collaboration with silicon and package designers to satisfy SI, PI and EMI requirements
Hands-on, in the lab, verification of prototypes and silicon to ensure robust signal integrity
Competitive Technical Analysis and Benchmarking
Providing expert advice on design guidelines, constraints and solutions to partner / customer system
Candidate Profile :
8+ years of relevant Design experience
Strong Design knowledge in high-speed serial links and SerDes technologies and signal integrity analysis of
interfaces such as PCIe Gen5, USB4, DisplayPort, HDMI, 25G SerDes Links, PAM4, MIPI M-PHY, etc.
Channel modeling, IBIS-AMI model development, and system level simulations
Behavioral modeling and custom design of different blocks in transceivers (FFE, CTLE, DFE, CDR, PLL, PGA,
Digital filters, etc.)
Hands-on experience in extracting S-parameters or lumped models from packages and PCBs, converting it
into Spice and / or behavioral compatible circuit models, and assessing the performance in frequency and time
domains using simulation tools
High Speed Modeling Experience in one or more of the following Ansys SI, HFSS etc.
Silicon Performance characterization experience with lab equipment for high-speed digital systems VNA,
TDR, real-time scope, spectrum analyzer, etc.
Solid Use experience in one or more of the following software : MATLAB, Mathematica, etc.
Working knowledge of PCB materials and PCB stackup
Prior High Speed SerDes and High Speed Analog IC design experience
Background in 2D and 3D electromagnetic modeling, transmission line theory is a plus
MSEE is required; PhD is preferred
NXPis an Equal Opportunity / Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and / or expression, marital status, status as a disabled veteran and / or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law.
In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.