At Intel, we create world-changing technology that enriches the lives of every person on earth.
As a Package Failure Analysis Engineer your responsibilities will include but not be limited to :
Responsible for identifying and researching component failures to improve product yield, quality and / or reliability.
Evaluates the electrical and mechanical characteristics of integrated circuits, components, subcomponents, and systems to determine the root cause of failure.
Analyzes failure reports and recommends corrective action to prevent reoccurrence of problems. Uses all standard electronic test equipment (digital / analog) such as Logic analyzer, ICE, ITPO oscilloscope and test systems to do board failure analysis and debug.
May support new product transfer and startup and the automation and improvement of the failure analysis process.
Strives to proliferate shared learning across sites.
Maintain necessary records and reports.
Performs other related duties as required or as directed.
The ideal candidate must exhibit the following behavioral traits :
Ability to work effectively in multitasking environments in cross-functional and cross-cultural teams.
Strong problem solving abilities and communication skills.
Minimum Requirements :
Bachelor Degree in Electrical, Electronics, Mechanical, Chemical Engineering or related field.
Advanced English Level.
1+ Years Experience in use of Failure Analysis Tools in the electronic components industry.