Intel is in the midst of an exciting transformation, going beyond being a company that makes the world's best chips to one that also delivers wonderful experiences for people.
With help from talented employees like you, we will tightly integrate hardware, software and services into compelling experiences in pursuit of our vision.
If it is smart and connected, it is best with Intel.
As a Thermal Mechanical Engineering Student Worker in Intel's PC Client Group, you will work closely with Thermal and Mechanical Engineers to perform customer intelligence of new client systems, and characterize thermal performance of full thermal solutions or its components (cold plates, heat pipe, heat exchanger, vapor chamber and others).
o Perform technical teardowns of client computing systems (eg., a notebook computer), which consists of the following :
o Mechanical dimensions of the system and major components
o Thermal measurements during a high-stress workload
o Airflow measurements
o Technical documentation of test processes and results
o Executing system workloads and collecting power and temperature data.
o Support other engineering requests to measure, test, and verify thermal mechanical solutions in the client space. These tests would leverage similar capabilities as system teardowns.
Experience listed below would be obtained through a combination of your school work / classes / research and / or relevant previous job and / or internship experience
Inside this Business Group
The Client Computing Group is responsible for all aspects of the client computing business across Phone, Phablet, Tablet and PC platforms, leading Intel's efforts to transform client computing through technologies, new form factors, and driving Intel's corporate-
wide user experience initiatives. This spans all client device brands including hardware, software and connectivity ingredients for phones, tablets, Ultrabook™, All-
in-Ones, 2 in 1 computing devices, and home gateways.