Principal 3DIC Solutions Engineer
Cadence Design Systems, Inc.
hace 4 días

At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.

Our team is looking for a solution engineer for 3DIC (multi chiplet), advance package and board design & analysis. You will be working with top tier customer who pushes the design boundaries to address their needs / problem.

You will also engage closely with R&D to develop / test new technologies around chiplet & package design

Experience :

  • Experience working with PCIE, Ethernet or similar interface IP. *Experience leading and conducting customer board and package design reviews Experience with resolving signal integrity issues and channel design optimizations for packages and boards.
  • Experience in power analysis for board / package, AC impedance analysis, printed circuit board power distribution design, and decoupling capacitor optimizations, PDN routing inductance optimization.
  • Experience using lab equipment (power supply, signal generator, oscilloscope, prober station, TDR, VNA)
  • Review board / package layouts and simulate for crosstalk concerns, knowledge of transmission line theory, EM theory and terminations.
  • Hands-on experience in circuit simulation tools : Cadence Spectre, Cadence / Sigrity, scripting languages (Python, Perl, Tcl)
  • Experience in understanding and simulating ibis AMI models M.S. Electrical / Computer Engineering (or similar degree)
  • LI-MA1

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