As part of the Client Computing Group (CCG), you will be defining and bringing to reality, solutions that delight customers and grow Intel's business.
Your day to day deliverables will have a common objective : making it easier, faster and cheaper to innovate with Intel Architecture as compared with Intel's competition.
In this position, you will be responsible for thermal analysis, design, and integration for a variety of products and form factors, such as notebook computers and All-in-One PC's.
Your responsibilities will include :
In this role you will also respond to customer / client requests or events as they occur.
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Relevant experience can be obtained through school work, classes and project work, internships, military training, and / or work experience
Bachelor of Science or higher degree in Thermal, Mechanical, Materials, Chemical Engineering or related fields of study.
6+ months experience with Computational Fluid Dynamics (CFD) simulations.
1+ years’ experience with system and component cooling.
Approved courses on mechanical engineering concepts and principles such as Heat and Fluid Transfer, or Numerical Simulation.
Intermediate to advanced English Level.
1+ year relevant experience in design / analysis thermal solutions for electronic components and / or systems.
Experience with ANSYS IcePak, FloTHERM, ANSYS Fluent, Comsol Multiphysics, or similar tools to perform CFD.